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Semi-Conductor Dicing Cleaning System

●PLC with Chinese / English display panel.

● Available for 6”~12” wafer frame, and non-standard

spin could be offered under user’s request. (Freedom selection)

● Build-in vacuum generator and automatic drainage device.

● Enhancing cleaning effect by dual fluid nozzle .

● Pure nitrogen type cleaning dry-blow process is available.

It treat with such as cleaning and dry-blow after the wafer dicing.

　

■SPECIFICATION

Specification CL- 6801 CL- 1201

Work Piece Size (mm) 6"~8" 6"~12"

Applicable Tape Frame (mm) 2-6 2-6-1 2-8-1 2-6-1 2-8-1 2-10-1 2-12-1

Pressure Pump Unit (Mpa) 2~12 2~12

Table Rotation Speed (rpm) 0~3000 rpm/Max. 0~3000 rpm/Max.

Utilities

Power Supply AC110 / 220 V AC110 / 220 V

Air Pressure (kgf/cm²+G) 6 6

Air Flow Rate (L/min ANR) Max. 100 Max. 150

Water Pressure (kgf/cm²L) 2~3 2~3

Water Flow Rate (L/min), input Max. Max. 10 (0.2~10) Max. 15

N² Pressure (kgf/cm²+G) 4~5 4~5

N² Flow Rate (L/min(ANR)) Max. 100 Max. 150

Duct Required Suction (m³/min) Min. 5.0 Min. 5.0

Machine Size (mm) 850 x 450 x 1200 850 x 550 x 1200

Machine Mass (kg) 90 120

■SPECIFICATION
Specification	CL- 6801	CL- 1201
Work Piece Size (mm)	6"~8"	6"~12"
Applicable Tape Frame (mm)	2-6 2-6-1 2-8-1	2-6-1 2-8-1 2-10-1 2-12-1
Pressure Pump Unit (Mpa)	2~12	2~12
Table Rotation Speed (rpm)	0~3000 rpm/Max.	0~3000 rpm/Max.
Utilities
Power Supply	AC110 / 220 V	AC110 / 220 V
Air Pressure (kgf/cm²+G)	6	6
Air Flow Rate (L/min ANR)	Max. 100	Max. 150
Water Pressure (kgf/cm²L)	2~3	2~3
Water Flow Rate (L/min), input Max.	Max. 10 (0.2~10)	Max. 15
N² Pressure (kgf/cm²+G)	4~5	4~5
N² Flow Rate (L/min(ANR))	Max. 100	Max. 150
Duct Required Suction (m³/min)	Min. 5.0	Min. 5.0
Machine Size (mm)	850 x 450 x 1200	850 x 550 x 1200
Machine Mass (kg)	90	120