BACK GRINDING TAPE
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DENKA have developed BGE
and BGP series for rigorous demands in back-grinding process
,the features are£º
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¡ñ Non-cleaning type by using special glue and lessparticles.
¡ñ Non-water entering due to good adhesion to silicon wafer.
¡ñ A change of adhesive strength by elapsed is small, and less particles.
¡ñ Fit to asperity on the circuit side , and achieve good performance for grinding.
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